Description: Polyimide consisting of a polyimide film and silicone adhesive designed for high temperature masking applications, including the protection of gold edge fingers and edge connectors during wave soldering and reflow soldering processes within the PCB assembly industry. It is used in electrical insulation application meeting class H requirements. Main Features: . Thin and conformable enabling masking of uneven sufaces. . Wide operaturing tempreture range up to 500°F. . Excellent electrical insulation . Remove clearly without adhesive residue after exposure to heat/chemical Applications: . Masking for protection of gold fingers and edge connectors during wave soldering and reflow soldering processes or solder dip process within the PCB assembly industry. . Release surface in fabrication of parts cured at elevated temperatures. . Widely used for electrical insulation on transformer, motor, coil, PCB masking and so on.